North South University Library OPACMicrovias :
Lau, John H.
Microvias : for low-cost, high-density interconnects / John H. Lau and S. W. Ricky Lee - New York : McGraw-Hill, c2001. - xxiii, 565 p. : ill. ; 24 cm.
Includes index.
0071363270
Microelectronic packaging. Integrated circuits
Design and construction Semiconductors
Junctions Printed circuits
TK7874 / .L31684 2001
621.381046 / L366m
Microvias : for low-cost, high-density interconnects / John H. Lau and S. W. Ricky Lee - New York : McGraw-Hill, c2001. - xxiii, 565 p. : ill. ; 24 cm.
Includes index.
0071363270
Microelectronic packaging. Integrated circuits
Design and construction Semiconductors
Junctions Printed circuits
TK7874 / .L31684 2001
621.381046 / L366m