North South University Library OPACThree-dimensional molded interconnect devices (3D-MID) :
Franke, Jorg
Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers / Jorg Franke - Munich : Hanser Publications, c2014. - xii, 356 p. : ill. ; 25 cm.
9781569905517
Interconnects
Integrated circuit technology
Design and construction
TK7874.53 / .F7713 2014
Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers / Jorg Franke - Munich : Hanser Publications, c2014. - xii, 356 p. : ill. ; 25 cm.
9781569905517
Interconnects
Integrated circuit technology
Design and construction
TK7874.53 / .F7713 2014