TY  - BOOK
AU  - Lau,John H.
AU  - Lee,S.W.Ricky
TI  - Microvias: for low-cost, high-density interconnects 
SN  - 0071363270
AV  - TK7874 .L31684 2001
U1  - 621.381046 
PY  - 2001///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic packaging. Integrated circuits
KW  - Design and construction Semiconductors
KW  - Junctions Printed circuits
N1  - Includes index
ER  -