Franke, Jorg <br/><br/>
Three-dimensional molded interconnect devices (3D-MID) :  materials, manufacturing, assembly, and applications for injection molded circuit carriers / 
Jorg Franke 
 - Munich :  Hanser Publications,  c2014. 
 - xii, 356 p. :  ill. ;  25 cm. 
<br/><br/><label>ISBN: </label>9781569905517 
<br/><br/><label>LCCN: </label>
<br/><br/><label>Subjects--Topical Terms: </label><br/>Interconnects<br/>Integrated circuit technology<br/>Design and construction
<br/><br/><label>LC Class. No.: </label>TK7874.53  / .F7713 2014