TY  - BOOK
AU  - Franke,Jorg
TI  - Three-dimensional molded interconnect devices (3D-MID): materials, manufacturing, assembly, and applications for injection molded circuit carriers 
SN  - 9781569905517
AV  - TK7874.53 .F7713 2014
PY  - 2014///
CY  - Munich
PB  - Hanser Publications
KW  - Interconnects
KW  - Integrated circuit technology
KW  - Design and construction
ER  -