| 000 | nam a22 a 4500 | ||
|---|---|---|---|
| 999 |
_c13505 _d13505 |
||
| 001 | BD-DhNSU-13505 | ||
| 003 | BD-DhNSU | ||
| 005 | 20190402140805.0 | ||
| 008 | 190402s2001 nyua|||g |||| 001 0|eng d | ||
| 010 | _a | ||
| 020 | _a0071363270 | ||
| 040 |
_aDLC _cDLC _dBD-DhNSU |
||
| 041 | _aeng | ||
| 050 | 0 | 0 |
_aTK7874 _b.L31684 2001 |
| 082 | 0 | 0 |
_a621.381046 _bL366m |
| 100 | 1 | _aLau, John H. | |
| 245 | 0 | 0 |
_aMicrovias : _bfor low-cost, high-density interconnects / _cJohn H. Lau and S. W. Ricky Lee |
| 260 |
_aNew York : _bMcGraw-Hill, _cc2001. |
||
| 300 |
_axxiii, 565 p. : _bill. ; _c24 cm. |
||
| 500 | _aIncludes index. | ||
| 650 | 0 | _aMicroelectronic packaging. Integrated circuits | |
| 650 | 0 | _aDesign and construction Semiconductors | |
| 650 | 4 | _aJunctions Printed circuits | |
| 700 | 1 | _aLee, S. W. Ricky | |
| 942 |
_2lcc _cBK |
||