| 000 | nam a22 a 4500 | ||
|---|---|---|---|
| 999 |
_c25379 _d25379 |
||
| 001 | BD-DhNSU-25379 | ||
| 003 | BD-DhNSU | ||
| 005 | 20190403071609.0 | ||
| 008 | 190403s2014 gw a|||g |||| 001 0|eng d | ||
| 010 | _a | ||
| 020 | _a9781569905517 | ||
| 040 |
_aDLC _cDLC _dBD-DhNSU |
||
| 041 | _aeng | ||
| 050 | 0 | 0 |
_aTK7874.53 _b.F7713 2014 |
| 100 | 1 | _aFranke, Jorg | |
| 245 | 0 | 0 |
_aThree-dimensional molded interconnect devices (3D-MID) : _bmaterials, manufacturing, assembly, and applications for injection molded circuit carriers / _cJorg Franke |
| 260 |
_aMunich : _bHanser Publications, _cc2014. |
||
| 300 |
_axii, 356 p. : _bill. ; _c25 cm. |
||
| 650 | 0 | _aInterconnects | |
| 650 | 4 | _aIntegrated circuit technology | |
| 650 | 4 | _aDesign and construction | |
| 942 |
_2lcc _cBK |
||