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Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers / Jorg Franke
Material type:
TextLanguage: English Publication details: Munich : Hanser Publications, c2014.Description: xii, 356 p. : ill. ; 25 cmISBN: - 9781569905517
- TK7874.53 .F7713 2014
| Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | |
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North South University Library | Non-fiction | TK7874.53.F7713 2014 (Browse shelf(Opens below)) | 1 | Available | 40633 | ||
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North South University Library | Non-fiction | TK7874.53.F7713 2014 (Browse shelf(Opens below)) | 2 | Available | 41152 |
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| TK7874.W46 1994 Principles of CMOS VLSI design : | TK7874.W46 2011 CMOS VLSI design : | TK7874.W46 2015 CMOS VLSI design : | TK7874.53.F7713 2014 Three-dimensional molded interconnect devices (3D-MID) : | TK7874.53.F7713 2014 Three-dimensional molded interconnect devices (3D-MID) : | TK7874.6.N43 2003 From ASICs to SOCs : | TK7874.6.N43 2003 From ASICs to SOCs : |
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