Microvias : for low-cost, high-density interconnects / John H. Lau and S. W. Ricky Lee
Material type:![Text](/opac-tmpl/lib/famfamfam/BK.png)
- 0071363270
- 621.381046 L366m
- TK7874 .L31684 2001
Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | |
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North South University Library | Non-fiction | TK7874.L31684 2001 (Browse shelf(Opens below)) | 1 | Available | 22446 | ||
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North South University Library | Non-fiction | TK7874.L31684 2001 (Browse shelf(Opens below)) | 2 | Available | 26574 |
Includes index.
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